This equipment can do hard-PR removed
8”/6” Wafer PR Stripping / Flux clean
60 pcs (depend on high pressure stripping process)
Soaking tank/High pressure spin chamber/Final rinse chamber
2 sets ,open cassette type with wafer edge align
Edge grip chuck
Touch type IPC + PLC Control
·55 liter SUS soaking tank
·Soaking process with agitation and megasonic function
·HPC 60~200 kg/cm2
·DI/Solvent hi-jet process chamber, nozzle recipe is programmable
·DI/N2 2-Fluid final clean chamber, nozzle recipe is programmable
·N2:Jet Nozzle 5~7kg/cm2
·O2 extinguisher
Maximum 95 °C
By Gravitating drain with cooling tank