單晶圓光(guāng)阻剝離機
設備特點:
·Soaking tank内 8” cassette slot(20 mm pitch)最多(duō)可(kě)容納 10 片芯片,配置Agitation 和(hé)兆聲波功能獨立運作。
·浸泡槽内化(huà)學品經過in line heater内部循環,高(gāo)壓spin chamber溶劑回收使用(yòng)。
·高(gāo)壓Spin chamber配備 HPC和(hé)二流體功能,可(kě)依産品制程特性做(zuò)調整。
·最終清洗腔體,以二流體去離子水(shuǐ)清洗爲主,輔以DI Rinse功能。
·制程腔體獨立設計,避免制程交互污染。
·Spin chamber芯片雙面清洗能力。
主要技術參數:
Purpose :
Applicable :
Throughput(UPH) :
Chamber Type :
Load / Unload :
Chuck :
Equipment Control :
Process Feature
Process Temp :
Drain :
This equipment can do hard-PR removed
8”/6” Wafer PR Stripping / Flux clean
60 pcs (depend on high pressure stripping process)
Soaking tank/High pressure spin chamber/Final rinse chamber
2 sets ,open cassette type with wafer edge align
Edge grip chuck
Touch type IPC + PLC Control
·55 liter SUS soaking tank
·Soaking process with agitation and megasonic function
·HPC 60~200 kg/cm2
·DI/Solvent hi-jet process chamber, nozzle recipe is programmable
·DI/N2 2-Fluid final clean chamber, nozzle recipe is programmable
·N2:Jet Nozzle 5~7kg/cm2
·O2 extinguisher
Maximum 95 °C
By Gravitating drain with cooling tank
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蘇ICP備2023006657号-1