·最高(gāo)精度±10μm@3 Sigma
·一機多(duō)頭，具備多(duō)芯片功能
·正裝貼片、倒裝芯片、多(duō)芯片貼裝一機實現
·環氧點膠粘片，助焊劑蘸取
·芯片供給兼容晶圓，華夫盒，gel pack盒，供料器等
·芯片可(kě)放置到carrier, boat, substrate, PCB, lead frame, wafer等
·熱(rè)處理(lǐ)過程：環氧，軟釺焊，熱(rè)壓等
·應用(yòng)領域廣：MCM，SIP，混合電路，銀玻璃，銀燒結，FOWLP工藝等