This equipment can do thin film coating process
8” Wafer PR spray coating
45 pcs (depend on film thickness)
Single wafer ultrasonic spray coating process chamber
2 sets ,open cassette type
Vacuum chuck with heat disk
Touch type IPC + PLC Control
·Wide range of flow rates – 1µl/min to 25ml/min
·High accuracy dispense ±0.5%
·Continuous flow capability
·Up to 80% reduction in material consumption
·Uniformity of film thickness is within ±10%
·Liquid can be atomization with viscosity less than 50cp
·Ultrasonic driver power levels are generally under 15 watts